Effect of hexamethylenetetramine on surface smoothness of electroplated copper coating

نویسندگان

چکیده

In this paper, hexamethyltetramine is introduced into the electroplating bath to improve surface morphology of electrodeposited copper. The cyclic voltammetry (CV) and dynamic polarization curves are used study effect Cu(Ⅰ) on electrochemical behaviors solution. After implementing copper experiment, scanning electron microscope (SEM) X-ray diffraction (XRD) explore influence Surface crystal plane orientation results show that 5ppm 7.5ppm can solve problem loose uneven electroplated layer caused by Cu(Ⅰ).

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ژورنال

عنوان ژورنال: E3S web of conferences

سال: 2021

ISSN: ['2555-0403', '2267-1242']

DOI: https://doi.org/10.1051/e3sconf/202126702066